Methods of continuously wet etching a patterned substrate
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United States of America Patent
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Mar 29, 2016
Grant Date -
Aug 21, 2014
app pub date -
Sep 19, 2012
filing date -
Sep 30, 2011
priority date (Note) -
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Abstract
Metalized web substrate is wet etched in a reaction vessel by contacting with oxidizing and metal complexing agent to remove metal from unpatterned region. Following etching, substrate is rinsed, and rinse is at least partly recycled. Concentrations of oxidizing and metal complexing agents in the etchant bath are maintained by delivering replenishment feeds of each. Concentration of metal in the etchant bath is maintained by discharging some of the etchant bath. Replenishment rates of oxidizing and metal complexing agents and etchant removal rate are determined based at least in part on rate that metal etched from the substrate enters the etchant bath.
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