Polishing composition

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United States of America Patent

PATENT NO 9303191
APP PUB NO 20150053887A1
SERIAL NO

14359357

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Abstract

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The polishing composition of the present invention is a polishing composition for polishing a tungsten-containing metal layer formed on an insulating layer, the polishing composition comprising: abrasive grains; one or more halogen acids selected from the group consisting of iodic acid, iodous acid, and hypoiodous acid; a strong acid; a hydrogen-ion-supplying agent; and water.

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Patent Owner(s)

Patent OwnerAddress
NITTA HAAS INCORPORATEDOSAKA-SHI OSAKA 556-0022

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Hosokawa, Koichiro Kyoto, JP 3 6
Ota, Yoshiharu Kyoto, JP 12 38
Yoshida, Shoichiro Kyoto, JP 2 36

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