Method and system for electrically coupling a chip to chip package
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United States of America Patent
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Apr 5, 2016
Grant Date -
Jan 19, 2012
app pub date -
Sep 23, 2011
filing date -
Oct 15, 2001
priority date (Note) -
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status (Latency Note)
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Abstract
A chip and a chip package can transmit information to each other by using a set of converters capable of communicating with each other through the emission and reception of electromagnetic signals. Both the chip and the chip package have at least one such converter physically disposed on them. Each converter is able to (1) convert received electromagnetic signals into electronic signals, which it then may relay to leads on the device on which it is disposed; and (2) receive electronic signals from leads on the device on which it is disposed and convert them into corresponding electromagnetic signals, which it may transmit to a corresponding converter on the other device. Not having a direct physical connection between the chip and the chip package decreases the inductive and capacitive effects commonly experienced with physical bonds.
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