Photocurable/thermosetting resin composition

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United States of America Patent

PATENT NO 9310680
APP PUB NO 20140147776A1
SERIAL NO

14127078

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Abstract

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Provided is an alkali-developable photocurable/thermosetting resin composition from which a cured coating film that has excellent thermal shock resistance and exhibits excellent PCT resistance, HAST resistance and electroless gold plating resistance, which are important as a solder resist for semiconductor packages, can be formed. The alkali-developable photocurable/thermosetting resin composition is characterized by comprising (A) a carboxyl group-containing photosensitive resin, (B) a photopolymerization initiator, (C) a block copolymer and (D) a thermosetting component.

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Patent Owner(s)

Patent OwnerAddress
TAIYO HOLDINGS CO LTD388 OAZA OHKURA RANZAN-MACHI HIKI-GUN SAITAMA 355-0222

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Arima, Masao Saitama, JP 32 248
Ito, Nobuhito Saitama, JP 8 67

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