Winding-type solid electrolytic capacitor package structure using a carrier board and method of manufacturing the same
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United States of America Patent
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Apr 12, 2016
Grant Date -
Sep 18, 2014
app pub date -
Mar 18, 2013
filing date -
Mar 18, 2013
priority date (Note) -
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Abstract
A winding-type solid electrolytic capacitor package structure includes a substrate body, a winding capacitor, a package body and an electrode unit. The winding capacitor has a winding body, a positive conductive lead pin having a positive end surface, and a negative conductive lead pin having a negative end surface. The package body is disposed on the substrate body to enclose the winding body, and the package body has a first lateral surface substantially flushed with the positive end surface and a second lateral surface substantially flushed with the negative end surface. The electrode unit includes a positive electrode structure for covering the first lateral surface and electrically contacting the positive end surface and a negative electrode structure for covering the second lateral surface and electrically contacting the negative end surface.
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