Semiconductor packages having polymer-containing substrates and methods of forming same
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United States of America Patent
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Apr 12, 2016
Grant Date -
Mar 28, 2013
app pub date -
Sep 22, 2011
filing date -
Sep 22, 2011
priority date (Note) -
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Abstract
A method includes applying a polymer-comprising material over a carrier, and forming a via over the carrier. The via is located inside the polymer-comprising material, and substantially penetrates through the polymer-comprising material. A first redistribution line is formed on a first side of the polymer-comprising material. A second redistribution line is formed on a second side of the polymer-comprising material opposite to the first side. The first redistribution line is electrically coupled to the second redistribution line through the via.
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