Semiconductor device and method of forming leadframe with conductive bodies for vertical electrical interconnect of semiconductor die
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United States of America Patent
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Apr 12, 2016
Grant Date -
Nov 15, 2012
app pub date -
May 12, 2011
filing date -
May 12, 2011
priority date (Note) -
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Abstract
A semiconductor device has a semiconductor die mounted to a substrate. A leadframe has a base plate and integrated tie bars and conductive bodies. The tie bars include a down step with an angled surface and horizontal surface between the conductive bodies. The leadframe is mounted to the semiconductor die and substrate with the base plate disposed on a back surface of the semiconductor die and the conductive bodies disposed around the semiconductor die and electrically connected to the substrate. An encapsulant is deposited over the substrate and semiconductor die and into the down step of the tie bars. A conductive layer is formed over the conductive bodies to inhibit oxidation. The leadframe is singulated through the encapsulant in the down step and through the horizontal portion of the tie bars to electrically isolate the conductive bodies. A semiconductor package can be mounted to the substrate and semiconductor die.
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