Semiconductor packages
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United States of America Patent
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Apr 12, 2016
Grant Date -
Jan 8, 2015
app pub date -
Sep 26, 2014
filing date -
Sep 5, 2012
priority date (Note) -
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Abstract
A semiconductor package may include a first substrate, a second substrate facing the first substrate, a plurality of first electrical connections disposed between the first substrate and the second substrate, and a first material disposed between the first substrate and the second substrate. The plurality of first electrical connections may electrically couple the first substrate and the second substrate to each other. The first material may surround each of the plurality of first electrical connections, and a width of the first material proximal the first substrate may be smaller than a width of the first material proximal the second substrate.
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