Ductile mode drilling methods for brittle components of plasma processing apparatuses
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United States of America Patent
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Apr 19, 2016
Grant Date -
Jul 31, 2014
app pub date -
Jan 30, 2013
filing date -
Jan 30, 2013
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Abstract
A method of drilling holes comprises ductile mode drilling the holes in a component of a plasma processing apparatus with a cutting tool wherein the component is made of a nonmetallic hard and brittle material. The method comprises drilling each hole in the component by controlling a depth of cut while drilling such that a portion of the brittle material undergoes high pressure phase transformation and forms amorphous portions of the brittle material during chip formation. The amorphous portions of the brittle material are removed from each hole such that a wall of each hole formed in the component has an as drilled surface roughness (Ra) of about 0.2 to 0.8 μm.
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