Method of recovering a bonding apparatus from a bonding failure

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United States of America Patent

PATENT NO 9314869
APP PUB NO 20130180957A1
SERIAL NO

13350363

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Abstract

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A method of recovering a bonding apparatus from a bonding failure to resume a normal operating state for semiconductor chip fabrication is disclosed. The bonding apparatus comprises: i) a bonding tool for bonding a wire between a semiconductor chip and a substrate; and ii) a position sensor. Specifically, the method comprises the steps of: a) the position sensor determining a position of the bonding tool when the bonding tool contacts a surface to bond the wire to the substrate; b) the bonding apparatus detecting a bonding failure caused by detachment of the semiconductor from the substrate based on the position of the bonding tool; and c) the bonding apparatus detaching the semiconductor chip from the wire.

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Patent Owner(s)

Patent OwnerAddress
ASMPT SINGAPORE PTE LTD2 YISHUN AVENUE 7 SINGAPORE 768924

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Lee, Wai Wah Singapore, SG 4 35
Li, Jun Feng Singapore, SG 2 9
Tan, Soo Kin Kenny Singapore, SG 1 9
Wong, Wei Boon Singapore, SG 1 9

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