CMP pad conditioner, and method for producing the CMP pad conditioner

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United States of America Patent

PATENT NO 9314901
APP PUB NO 20140094101A1
SERIAL NO

14117936

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Abstract

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This invention relates to a conditioner for a CMP (Chemical Mechanical Polishing) pad, which is used in a CMP process which is part of the fabrication of a semiconductor device, and more particularly, to a CMP pad conditioner in which the structure of the cutting tips is such that the change in the wear of the polishing pad is not great even when different kinds of slurry are used and when there are changes in pressure of the conditioner, and to a method of manufacturing the same.

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Patent Owner(s)

Patent OwnerAddress
SAMSUNG ELECTRONICS CO LTDGYEONGGI DO ROAD SOUTH KOREA SAMSUNG SUWON CITY LINGTONG DISTRICT NO 129 SUWON GYEONGGI-DO
EHWA DIAMOND INDUSTRIAL CO LTDKYUNGGIDO 447804

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Boo, Jae Phil Seongnam-si, KR 19 53
Choi, Jae Kwang Suwon-si, KR 5 10
Kim, Youn Chul Hwaseong-si, KR 8 36
Lee, Joo Han Seongnam-si, KR 17 112
Lee, Seh Kwang Yongin-si, KR 9 21

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