Module and electronic apparatus

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 9316499
APP PUB NO 20120304768A1
SERIAL NO

13478850

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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A module includes a first rigid substrate including an analog circuit; a second rigid substrate including a digital circuit; a third rigid substrate including an angular velocity sensor; a first connecting portion that connects the first rigid substrate and the second rigid substrate so as to electrically connect the analog circuit and the digital circuit, and that has flexibility; and a second connecting portion that connects the first rigid substrate and the third rigid substrate so as to electrically connect the analog circuit and the angular velocity sensor, and that has flexibility.

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Patent Owner(s)

  • SEIKO EPSON CORPORATION

International Classification(s)

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Chino, Taketo Hokuto, JP 39 280
Kitamura, Shojiro Suwa, JP 30 328
Kobayashi, Yoshihiro Komagane, JP 149 993
Ogami, Michiharu Sakata, JP 5 34
Sakuma, Masayasu Kamiina, JP 26 92

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