Semiconductor device and method for fabricating semiconductor device

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 9318615
APP PUB NO 20150249156A1
SERIAL NO

14318207

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Abstract

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A semiconductor device according to an embodiment includes a gate electrode, a first dielectric film, an oxide semiconductor film, a second dielectric film, a source electrode and a drain electrode. The first dielectric film is placed above the gate electrode. The oxide semiconductor film is placed above the first dielectric film. The oxide semiconductor film is formed to have a film thickness in a first contact region in contact with the source electrode and a second contact region in contact with the drain electrode larger than a film thickness in a channel region of the oxide semiconductor film so that a film portion of the first contact region projects toward the source electrode side and a film portion of the second contact region projects toward the drain electrode side.

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Patent Owner(s)

  • TOSHIBA MEMORY CORPORATION

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Fukase, Kazuya Hachioji, JP 8 32
Momose, Hisayo Yokohama, JP 27 221
Morooka, Tetsu Yokohama, JP 30 222
Ohguro, Tatsuya Yokohama, JP 71 698

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