Electrical interconnect IC device socket

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 9320133
APP PUB NO 20130206468A1
SERIAL NO

13880461

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Abstract

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A surface mount electrical interconnect is disclosed that provides an interface between a PCB and solder balls of a BGA device. The electrical interconnect includes a socket substrate and a plurality of electrically conductive contact members. The socket substrate has a first layer with a plurality of openings configured to receive solder balls of the BGA device and has a second layer with a plurality of slots defined therethrough that correspond to the plurality of openings. The contact members may be disposed in the openings in the first layer and through the plurality of slots of the second layer of the socket substrate. The contact members can be configured to engage a top portion, a center diameter, and a lower portion of the solder ball of the BGA device. Each contact member electrically couples a solder ball on the BGA device to the PCB.

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Patent Owner(s)

  • HSIO TECHNOLOGIES, LLC

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Rathburn, James Maple Grove, US 48 2930

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