Electronic circuit module component
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United States of America Patent
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Apr 19, 2016
Grant Date -
Feb 13, 2014
app pub date -
Aug 5, 2013
filing date -
Aug 9, 2012
priority date (Note) -
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status (Latency Note)
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Abstract
One aspect of an electronic circuit module component is an electronic circuit module component formed by joining a board and an electronic component comprising an element body having a mounting surface and a plurality of side faces to each other with solder; the electronic component comprising a first terminal electrode formed on the mounting surface and one of the plurality of side faces, a second terminal electrode formed on the mounting surface and another side face in the plurality of side faces, and an oxide film covering at least a part of surfaces of side face parts of the first and second terminal electrodes formed on the side faces; wherein mounting parts of the first and second terminal electrodes formed on the mounting surface are joined to the board with the solder.
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