Solder ball and electronic member

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United States of America Patent

PATENT NO 9320152
SERIAL NO

14405691

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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A solder ball which suppresses generation of voids in a joint, excels in a thermal fatigue property, and can also obtain a good drop impact resistance property, and an electronic member using the same are provided. The solder ball is formed of a Sn—Bi type alloy containing Sn as a main element, 0.3 to 2.0 mass % of Cu, 0.01 to 0.2 mass % of Ni, and 0.1 to 3.0 mass % of Bi, and an intermetallic compound of (Cu, Ni)6Sn5 is formed in the Sn—Bi alloy so that the generation of voids in the joint when being jointed to an electrode is suppressed, a thermal fatigue property is excellent, and a good drop impact resistance property can also be obtained.

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Patent Owner(s)

Patent OwnerAddress
NIPPON STEEL CHEMICAL & MATERIAL CO LTD13-1 NIHONBASHI 1-CHOME CHUO-KU TOKYO 103-0027

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Kimura, Katsuichi Saitama, JP 4 29
Kobayashi, Takayuki Tokyo, JP 235 2198
Sagawa, Tadayuki Saitama, JP 1 6
Tanaka, Masamoto Tokyo, JP 18 134
Terashima, Shinichi Tokyo, JP 25 250

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