Structures formed using monocrystalline silicon and/or other materials for optical and other applications
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United States of America Patent
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Apr 26, 2016
Grant Date -
Jul 11, 2013
app pub date -
Apr 24, 2012
filing date -
Jan 10, 2012
priority date (Note) -
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Abstract
To fabricate an interposer for interfacing waveguides (e.g. optical fiber cables) to transducers, a cavity (410) is formed in a top surface of a substrate. A first layer (520) is formed over the cavity's bottom surface, with one or more gaps in the first layer's top surface. A second layer (3410) is formed in the one or more gaps. The second layer overlaps the first layer. At least part of the first layer is removed to form channels separated from each other by portions of the second layer that are located in the one or more gaps; at least part of the first layer is removed from under the second layer. The second layer portions in the one or more gaps provide one or more spacers in the cavity; these one or more spacers at least partially cover the channels. Waveguides can be placed into the channels.
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