Spalling with laser-defined spall edge regions

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United States of America Patent

PATENT NO 9324564
SERIAL NO

14797990

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Abstract

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Laser ablation can be used to form a trench within at least a blanket layer of a stressor layer that is atop a base substrate. A non-ablated portion of the stressor layer has an edge that defines the edge of the material layer region to be spalled. Laser ablation can also be used to form a trench within a blanket material stack including at least a plating seed layer. A stressor layer is formed on the non-ablated portions of the material stack and one portion of the stressor layer has an edge that defines the edge of the material layer region to be spalled. Laser ablation can be further used to form a trench that extends through a blanket stressor layer and into the base substrate itself. The trench has an edge that defines the edge of the material layer region to be spalled.

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Patent Owner(s)

Patent OwnerAddress
KING ABDULAZIZ CITY FOR SCIENCE AND TECHNOLOGYP O BOX 6086 RIYADH 11442

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Alhomoudi, Ibrahim Alhufof, SA 8 27
Bedell, Stephen W Wappingers Falls, US 409 5503
Cheng, Cheng-Wei White Plains, US 142 576
Fogel, Keith E Hopewell Junction, US 270 4133
Li, Ning White Plains, US 707 4028
Sadana, Devendra K Pleasantville, US 897 9865
Saenger, Katherine L Ossining, US 127 2890
Sosa, Norma E New York, US 5 10

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