Method of manufacturing flip-chip type semiconductor device
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United States of America Patent
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Apr 26, 2016
Grant Date -
Dec 11, 2014
app pub date -
Jan 15, 2013
filing date -
Jan 18, 2012
priority date (Note) -
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Abstract
An object of the present invention is to provide a method of manufacturing a flip-chip type semiconductor device with a simplified process, in which various types of information are supplied in a visually recognizable manner. The present invention relates to a method of manufacturing a flip-chip type semiconductor device comprising: a step A of laminating on a semiconductor wafer a film for the backside of a flip-chip type semiconductor, in which the film is to be formed on the backside of a semiconductor element that is flip-chip connected onto an adherend; a step B of dicing the semiconductor wafer; and a step C of laser marking the film for the backside of a flip-chip type semiconductor, wherein the film for the backside of a flip-chip type semiconductor in the step C is uncured.
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