Interposers with circuit modules encapsulated by moldable material in a cavity, and methods of fabrication
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United States of America Patent
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Apr 26, 2016
Issued Date -
N/A
app pub date -
Dec 2, 2014
filing date -
Mar 12, 2014
priority date (Note) -
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Abstract
Stacked dies (110) are encapsulated in an interposer's cavity (304) by multiple encapsulant layers (524) formed of moldable material. Conductive paths (520, 623) connect the dies to the cavity's bottom all (304B) and, through TSVs passing through the bottom wall, to a conductor below the interposer. The conductive paths can be formed in segments each of which is formed in a through-hole (514) in a respective encapsulant layer. Each segment can be formed by electroplating onto a lower segment; the electroplating current can be provided from below the interposer through the TSVs and earlier formed segments. Other features are also provided.
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