Integrated circuit packaging system with external interconnect and method of manufacture thereof

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 9324641
APP PUB NO 20130249068A1
SERIAL NO

13425286

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Abstract

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A method of manufacture of an integrated circuit packaging system includes: providing a routable distribution layer on a leadframe; mounting an integrated circuit over the routable distribution layer; encapsulating with an encapsulation over the routable distribution layer; peeling the leadframe away from the routable distribution layer with a bottom distribution side of the routable distribution layer exposed from the encapsulation; and mounting an external interconnect on the routable distribution layer.

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Patent Owner(s)

  • STATS CHIPPAC PTE. LTD.

International Classification(s)

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Chua, Linda Pei Ee Singapore, SG 133 2720
Do, Byung Tai Singapore, SG 246 5096
Trasporto, Arnel Senosa Singapore, SG 61 486

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