Signal delivery in stacked device

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 9324690
APP PUB NO 20130036606A1
SERIAL NO

13361183

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ATTORNEY / AGENT: (SPONSORED)

Importance

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Abstract

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Some embodiments include apparatus, systems, and methods having a base, a first die, a second arranged in a stacked with the first die and the base, and a structure located in the stack and outside at least one of the first and second dice and configured to transfer signals between the base and at least one of the first and second dice.

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Patent Owner(s)

  • MICRON TECHNOLOGY, INC.

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Advani, Rahul Boise, US 6 300
Hiatt, Mark Eagle, US 17 573
Keeth, Brent Boise, US 345 10329
Lee, Terry R Boise, US 138 4213
Schreck, John F Lucas, US 78 1326
Tuttle, Mark Meridian, US 22 636

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