Universal serial bus hybrid footprint design

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United States of America Patent

PATENT NO 9326380
APP PUB NO 20140182914A1
SERIAL NO

13727701

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Abstract

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A universal serial bus hybrid footprint design is described herein. The design includes an outer row of one or more surface mount technology (SMT) contacts and an inner row of one or more printed through holes (PTH). The hybrid footprint design enables a data through put of at least 10 Gbps.

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Patent Owner(s)

  • INTEL CORPORATION

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Chen, Kuan-Yu Hillsboro, US 188 2039
Heck, Howard L Hillsboro, US 36 305

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