Method of manufacturing thermal module with enhanced assembling structure
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United States of America Patent
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May 3, 2016
Grant Date -
Sep 17, 2015
app pub date -
Mar 11, 2014
filing date -
Mar 11, 2014
priority date (Note) -
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status (Latency Note)
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Abstract
A thermal module with enhanced assembling structure includes a base and a heat pipe. The base is formed on a middle portion with a longitudinal receiving recess, which has two end portions forming two supporting portions and a middle portion formed into an opening. A first and a second extended arm are formed at junctions between the receiving recess and two longitudinal sides of the opening. Wall surfaces of the first and second extended arms adjacent to the longitudinal sides of the opening are formed with alternating elevated and sunken areas. The heat pipe is held down in the receiving recess by the first and second extended arms to fitly engage with the elevated and sunken areas. Therefore, there is an increased fitting tightness between the heat pipe and the base to ensure enhanced assembling strength of the thermal module and reduce the manufacturing cost thereof.
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