Semi-aqueous polymer removal compositions with enhanced compatibility to copper, tungsten, and porous low-K dielectrics
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United States of America Patent
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May 3, 2016
Grant Date -
Sep 4, 2014
app pub date -
May 31, 2012
filing date -
Jun 1, 2011
priority date (Note) -
In Force
status (Latency Note)
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Abstract
A composition is provided that is effective for removing post etch treatment (PET) polymeric films and photoresist from semiconductor substrates. The composition exhibits excellent polymer film removal capability while maintaining compatibility with copper and low-κ dielectrics and contains water, ethylene glycol, a glycol ether solvent, morpholinopropylamine and a corrosion inhibiting compound and optionally one or more metal ion chelating agent, one or more other polar organic solvent, one or more tertiary amine, one or more aluminum corrosion inhibition agent, and one or more surfactant.
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International Classification(s)
- C09K:MATERIALS FOR APPLICATIONS NOT OTHERWISE PROVIDED ....
- C08J:WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTE....
- H01L:SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICE....
- B81C:PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE M....
- G03F:PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNE....
- C11D:DETERGENT COMPOSITIONS
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