Method for mitigating cure shrinkage in high temperature-processed thermosetting adhesives and SMC

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United States of America Patent

PATENT NO 9328266
APP PUB NO 20140011016A1
SERIAL NO

13657245

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Abstract

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A thermosetting polymer composite composition (such as thermosetting SMC composition) or a thermosetting adhesive composition containing reduced-volume hollow shape-memory alloy particles in the thermosetting polymer composite composition or adhesive composition experiences little or no volume loss during a curing at a temperature above the transformation temperature for the particles.

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Patent OwnerAddress
GM GLOBAL TECHNOLOGY OPERATIONS LLCP O BOX 300 MAIL CODE 482-C24-A65 DETROIT MI 48265-3000

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Buravalla, Vidyashankar R Bangalore, IN 11 177
Vanimisetti, Sampath K Bangalore, IN 9 134
Wang, Chen-Shih Warren, US 36 445

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