Method of forming a hermetically sealed fiber to chip connection

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United States of America Patent

PATENT NO 9329336
APP PUB NO 20140010494A1
SERIAL NO

13543156

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Abstract

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Disclosed are methods of providing a hermetically sealed optical connection between an optical fiber and an optical element of a chip and a photonic-integrated chip manufactured using such methods.

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Patent Owner(s)

  • MICRON TECHNOLOGY, INC.

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Meade, Roy Boise, US 55 288
Sandhu, Gurtej Boise, US 243 7795

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