Methods of promoting adhesion between underfill and conductive bumps and structures formed thereby

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 9330993
APP PUB NO 20140175634A1
SERIAL NO

13721266

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Abstract

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Methods of forming a microelectronic packaging structure and associated structures formed thereby are described. Those methods and structures may include modifying an underfill material with one of a thiol adhesion promoter, an azole coupling agent, surface modified filler, and peroxide based cross-linking polymer chemistries to greatly enhance adhesion in package structures utilizing the embodiments herein.

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Patent Owner(s)

Patent OwnerAddress
INTEL CORPORATION2200 MISSION COLLEGE BOULEVARD SANTA CLARA CA 95054

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Ananthakrishnan, Nisha Chandler, US 31 131
Bai, Yiqun Chandler, US 22 399
Canham, Beverly J Mesa, US 4 26
Jayaraman, Saikumar Chandler, US 84 1064
Krishnan, Arjun Chandler, US 21 221
Nagarajan, Sivakumar Chandler, US 34 397
Ramalingam, Suriyakala Chandler, US 16 48
Wei, Yuying Chandler, US 6 10
Xiu, Yonghao Chandler, US 12 293

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