Heat management in electronics packaging

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 9331000
APP PUB NO 20150287661A1
SERIAL NO

14677601

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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An electronics packaging system includes an insulator that electrically insulates a heat sink from electrical leads. An interface between the insulator and the heat sink includes a stress reliever constructed such that a stiffness of the interface is greater than the stiffness of the interface without the stress reliever.

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Patent Owner(s)

  • KYOCERA AMERICA, INC.

International Classification(s)

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Eblen, Mark Temecula, US 5 12
Hira, Shinichi San Diego, US 9 165
Il-Park, Chong Poway, US 1 1
Kim, Franklin San Diego, US 7 24

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