Method for producing structured microcarriers
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United States of America Patent
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May 10, 2016
Grant Date -
Jul 9, 2015
app pub date -
Jul 22, 2013
filing date -
Jul 24, 2012
priority date (Note) -
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Abstract
The present invention relates to a method for producing microcarriers, the method comprising the steps of providing a wafer having a bottom layer, a top layer and an insulating layer, structuring the top layer to define at least one three-dimensional structure on the top surface of the top layer, etching away the top layer to delineate lateral walls of bodies of the microcarriers, applying a continuous polymer layer over the top surface of the bodies of the microcarriers, removing the bottom layer and the insulating layer, structuring the bottom surfaces of the bodies of the microcarriers to define at least one three-dimensional structure on the bottom surface of each body, and removing the polymer layer to release the microcarriers.
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