Lead-free solder composition for glass

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United States of America Patent

PATENT NO 9333594
APP PUB NO 20140044589A1
SERIAL NO

13712326

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Abstract

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The present invention provides a lead-free solder composition for glass. The lead-free solder composition for glass includes indium, zinc, and tin. The indium (In) ranges from about 30.0 wt % to about 60 wt %. The zinc (Zn) ranges from about 0.01 wt % to about 11.0 wt %. The tin (Sn) is included as a remaining component.

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Patent Owner(s)

Patent OwnerAddress
KCC GLASS CORPORATION587 GANGNAM-DAERO SEOCHO-GU SEOUL 06526 06526

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Bak, Min Ho Ulsan, KR 1 2
Jeong, Hae Won Gyeonggi-do, KR 17 63
Joo, Hong Nho Chungcheongnam-do, KR 1 2
Jung, Hyun Chae Gyeonggi-do, KR 3 4
Kim, Seung Kyu Gyeonggi-do, KR 5 20
Lee, Joo Dong Gyeonggi-do, KR 8 7
Lee, Sun Myung Gyeonggi-do, KR 2 2
Lee, Tae Seung Gyeonggi-do, KR 12 26
Park, Hyun Dal Gyeonggi-do, KR 10 30
Yoon, Ho June Chungcheongnam-do, KR 1 2

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