Multilayer structure in an integrated circuit for damage prevention and detection and methods of creating the same
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United States of America Patent
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May 10, 2016
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N/A
app pub date -
Dec 30, 2014
filing date -
Dec 30, 2014
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Abstract
Various embodiments facilitate die protection for an integrated circuit. In one embodiment, a multilayer structure is formed in multiple levels and along the edges of a die to prevent and detect damages to the die. The multilayer structure includes a support layer, a first plurality of dielectric pillars overlying the support layer, a metal layer that fills spaces between the first plurality of dielectric pillars, an insulation layer overlying the first plurality of dielectric pillars and the metal layer, a second plurality of dielectric pillars overlying the insulation layer, and a second metal layer that fills spaces between the second plurality of dielectric pillars.
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