Semiconductor device and method of fabricating the same

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 9337121
APP PUB NO 20150194363A1
SERIAL NO

14324724

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Abstract

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Provided are a semiconductor device and a method of fabricating the same. The semiconductor device includes: an active region provided on a substrate; an inlet channel formed as a single cavity buried in one side of the substrate; an outlet channel formed as a single cavity buried in the other side of the substrate; a micro channel array comprising a plurality of micro channels, wherein the plurality of micro channels are formed as a plurality of cavities buried in the substrate, and one end of the micro channel array is connected to a side of the inlet channel and the other end of the micro channel array is connected to a side of the outlet channel; and a micro heat sink array separating the micro channels from one another.

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Patent Owner(s)

  • ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Bae, Sung-Bum Daejeon, KR 17 69
Chang, Woojin Daejeon, KR 23 83
Jun, Chi Hoon Daejeon, KR 55 880
Ko, Sang Choon Daejeon, KR 39 293
Moon, Seok-Hwan Daejeon, KR 25 73
Mun, Jae Kyoung Daejeon, KR 55 281
Na, Je Ho Seoul, KR 3 33
Nam, Eun Soo Daejeon, KR 89 500
Park, Young Rak Daejeon, KR 21 136

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