Environmentally-assisted technique for transferring devices onto non-conventional substrates

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United States of America Patent

PATENT NO 9337169
APP PUB NO 20140335678A1
SERIAL NO

14340425

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Abstract

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A device fabrication method includes: (1) providing a growth substrate including an oxide layer; (2) forming a metal layer over the oxide layer; (3) forming a stack of device layers over the metal layer; (4) performing fluid-assisted interfacial debonding of the metal layer to separate the stack of device layers and the metal layer from the growth substrate; and (5) affixing the stack of device layers to a target substrate.

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Patent Owner(s)

  • THE BOARD OF TRUSTEES OF THE LELAND STANFORD JUNIOR UNIVERSITY

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Kim, Dong Rip Palo Alto, US 16 16
Lee, Chi-Hwan Stanford, US 8 12
Zheng, Xiaolin Stanford, US 10 49

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