Adhesion promotion in printed circuit boards

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United States of America Patent

PATENT NO 9338896
APP PUB NO 20140030425A1
SERIAL NO

13558019

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Abstract

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Compositions and methods for enhancing adhesion between a copper conducting layer and a dielectric material during manufacture of a printed circuit board. Conditioning compositions contain a functional organic compound and preferably a transition metal ion. The functional organic compound, e.g., a purine derivative, is capable of forming a self-assembled monolayer. Adhesion promoting compositions contain an acid, preferably an inorganic acid, and an oxidant. The latter compositions may also contain a corrosion inhibitor and/or a transition metal ion selected from among Zn, Ni, Co, Cu, Ag, Au, Pd or another Pt group metal. The corrosion inhibitor may comprise a nitrogen-containing aromatic heterocyclic compound.

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Patent Owner(s)

Patent OwnerAddress
CITIBANK N A388 GREENWICH STREET NEW YORK NY 10013

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Abys, Joseph A Guilford, US 55 702
Antonellis, Theodore Bethany, US 11 86
Owei, Abayomi I Rancho Cucamonga, US 8 42
Walch, Eric Solingen, DE 5 37

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