Ceramic substrate, and method of manufacturing the same
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United States of America Patent
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May 10, 2016
Grant Date -
Jun 19, 2014
app pub date -
Dec 18, 2013
filing date -
Dec 19, 2012
priority date (Note) -
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Abstract
A ceramic substrate is provided that includes a ceramic substrate main body including a principal surface, a connecting terminal portion disposed on the principal surface of the ceramic substrate main body that is capable of being connected to another component via solder, the connecting terminal portion including a copper layer and a coating metal layer covering a surface of the copper layer; a contact layer of titanium or chromium disposed between the ceramic substrate main body and the connecting terminal portion; and an intermediate layer disposed between the copper layer of the connecting terminal portion and the contact layer, the intermediate layer including one of a titanium-tungsten alloy, a nickel-chromium alloy, tungsten, palladium, and molybdenum. The contact layer and the intermediate layer are set back from a side surface of the copper layer in a substrate plane direction.
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