Soldering method

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United States of America Patent

PATENT NO 9339883
APP PUB NO 20150108205A1
SERIAL NO

14583183

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Abstract

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A welding method, including: forming a molten solder in a solder bath, forming a dynamic flow of the molten solder from the solder bath, and contacting an object to be welded with the dynamic flow of the molten solder and conducting welding. The surface of the molten solder includes a reduction layer. The oxygen content of the molten solder is below 10 ppm.

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Patent Owner(s)

Patent OwnerAddress
SHENZHEN KUNQI XINHUA CO LTDNO 2# 1/F BUILDING F NO 8# EAST AREA SHANGXUE TECHNOLOGY INDUSTRY CITY XUEXIANG BANTIAN LONGGANG DISTRICT SHENZHEN 518129

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Yan, Yongnong Shenzhen, CN 2 2

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