Liquid cooling of multiple components on a circuit board
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United States of America Patent
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May 17, 2016
Grant Date -
May 14, 2015
app pub date -
Nov 13, 2013
filing date -
Nov 12, 2013
priority date (Note) -
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status (Latency Note)
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Abstract
A method includes securing a primary cold plate to a secondary cold plate, wherein the primary cold plate is biased away from the secondary cold plate. The secondary cold plate is aligned with a circuit board having heat-generating components, wherein the primary cold plate is aligned with a processor. The method secures the aligned secondary cold plate to the circuit board with a first surface in thermal engagement with the heat-generating components, wherein the primary cold plate is pressed against the processor to overcome the bias, move the primary cold plate toward the secondary cold plate, position the primary cold plate in thermal engagement with the processor, and compress a thermal interface material between the primary and secondary cold plates. A cooling liquid is passed through a liquid cooling channel within the primary cold plate to draw heat from the processor and from the secondary cold plate.
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