Integrated device die and package with stress reduction features
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United States of America Patent
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May 17, 2016
Grant Date -
Jun 25, 2015
app pub date -
Dec 19, 2014
filing date -
Dec 20, 2013
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
An integrated device die and package is disclosed. The integrated device die includes a unitary body. The unitary body can have an upper portion comprising one or more active components. The upper portion can have first and second opposing lateral sides defining at least a portion of a periphery of the upper portion such that an upper surface of the upper portion is disposed between upper edges of the first and second opposing lateral sides. The unitary body can also have a lower portion monolithically formed with the upper portion. The lower portion can comprise a pedestal extending downwardly from the upper portion. The pedestal can be laterally inset from lower edges of the first and second opposing lateral sides. The pedestal can include a distal end portion configured to couple to a carrier.
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