Magnetic contacts

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United States of America Patent

PATENT NO 9343389
APP PUB NO 20150357311A1
SERIAL NO

14827056

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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Embodiments of the present disclosure are directed to integrated circuit (IC) package assemblies with magnetic contacts, as well as corresponding fabrication methods and systems incorporating such magnetic contacts. A first IC substrate may have a first magnet coupled with a first electrical routing feature. A second IC substrate may have a second magnet coupled with a second electrical routing feature. The magnets may be embedded in the IC substrates and/or electrical routing features. The magnets may generate a magnetic field that extends across a gap between the first and second electrical routing features. Electrically conductive magnetic particles may be applied to one or both of the IC substrates to form a magnetic interconnect structure that extends across the gap. In some embodiments, magnetic contacts may be demagnetized by heating the magnets to a corresponding partial demagnetization temperature (PDT) or Curie temperature. Other embodiments may be described and/or claimed.

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Patent Owner(s)

  • INTEL CORPORATION

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Albers, Sven Regensburg, DE 57 773
Ossiander, Teodora Sinzing, DE 8 24
Seidemann, Georg Landshut, DE 112 308
Skinner, Michael P San Jose, US 12 137

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