Millimeter wave bands semiconductor package
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United States of America Patent
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-
May 17, 2016
Grant Date -
Aug 13, 2015
app pub date -
Jul 18, 2014
filing date -
Feb 7, 2014
priority date (Note) -
In Force
status (Latency Note)
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Abstract
A millimeter wave bands semiconductor package includes a metal base body, a circuit board, and a metal cover body. The base body has a first non-penetration hole and a second non-penetration hole. The circuit board is disposed on the base body and has an input signal line and an output signal line on a front side surface thereof. The cover body is disposed on the circuit board and has a first penetration hole and a second penetration hole. The cover body is disposed such that the first penetration hole is disposed directly above the first non-penetration hole of the base body and the second penetration hole is disposed directly above the second non-penetration hole of the base body. Further, the first penetration hole and the first non-penetration hole constitute a first waveguide, and the second penetration hole and the second non-penetration hole constitute a second waveguide.
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