Semiconductor package and printed circuit board

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 9345126
APP PUB NO 20140268586A1
SERIAL NO

14198718

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Abstract

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A substrate of a semiconductor package comprises a conductor pattern which is formed in a surface layer, and is electrically connected to one terminal out of a power terminal and a ground terminal of a semiconductor element. The substrate also comprises in the surface layer a conductor pattern which is arranged while being separated from the conductor pattern, and a conductor pattern which is formed so as to have a wiring width thinner than that of the conductor pattern and connects the conductor pattern with the conductor pattern. The substrate also comprises a conductor pattern which is formed in an inner layer, faces the conductor pattern through a dielectric and is electrically connected to the other terminal out of the power terminal and the ground terminal of the semiconductor element.

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Patent Owner(s)

  • CANON KABUSHIKI KAISHA

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Hoshi, Sou Miura, JP 5 19
Murai, Yusuke Kawasaki, JP 10 53
Yamashita, Nobuaki Yokohama, JP 8 24

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