Molded casing, mold assembly and forming method
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United States of America Patent
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May 24, 2016
Grant Date -
Oct 16, 2014
app pub date -
Apr 16, 2013
filing date -
Apr 16, 2013
priority date (Note) -
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status (Latency Note)
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Abstract
A molded casing suitable for a handheld electronic device is provided. The handheld electronic device includes a body and the molded casing, and at least one part of the body is covered with the molded casing. The molded casing is in a uniform thickness and has a continuous mosaic surface. The mosaic surface is composed of a plurality of non-coplanar polygons, wherein an intersection line is formed between any two adjacent polygons. An end of any one of the intersection lines is connected to an end of another intersection line or an edge of the mosaic surface, and an equivalence radius of a vertex angle at each intersection line is less than or equal to 0.1 millimeter. A mold assembly and a forming method for fabricating the molded case are also provided.
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