Semiconductor device with face-to-face chips on interposer and method of manufacturing the same
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United States of America Patent
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May 24, 2016
Grant Date -
Jan 7, 2016
app pub date -
Apr 17, 2015
filing date -
Oct 25, 2013
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Abstract
A method of making a semiconductor device with face-to-face chips on interposer includes the step of attaching a chip-on-interposer subassembly on a heat spreader with the chip inserted into a cavity of the heat spreader so that the heat spreader provides mechanical support for the interposer. The heat spreader also provides thermal dissipation, electromagnetic shielding and moisture barrier for the enclosed chip. In the method, a second chip is also electrically coupled to a second surface of the interposer and an optional second heat spreader is attached to the second chip.
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