Interconnect substrate and electronic device
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United States of America Patent
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May 24, 2016
Grant Date -
Jun 18, 2015
app pub date -
Feb 24, 2015
filing date -
Aug 30, 2010
priority date (Note) -
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status (Latency Note)
Importance
Abstract
An interconnect substrate comprising a laminated body, including an electric conductor and an insulator, over which an electronic element is disposed, wherein the laminated body includes a first layer having at least one first conductor separated in an island shape, a first connecting member which is buried in the laminated body in order to electrically connect the electronic element and the first conductor, a second layer having a third conductor which is provided opposite to at least a partial region of the first conductor, a second conductor which is provided opposite to at least one of the first conductor and the third conductor with a layer of the insulator interposed therebetween, and a second connecting member, buried in the laminated body, which electrically connects the second conductor and the first conductor or the third conductor.
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