Two-step deposition with improved selectivity

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United States of America Patent

PATENT NO 9353444
APP PUB NO 20150275374A1
SERIAL NO

14225020

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Abstract

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A method for providing an electroless plating over at least one copper containing layer is provided. Surfaces of the at least one copper containing layer are sealed by selectively depositing a sealing layer of catalytically active metal on the at least one copper containing layer. The sealing layer is exposed to an electroless deposition bath that is more reactive to the catalytically active metal than to the at least one copper containing layer to provide an electroless deposition on the sealing layer.

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Patent Owner(s)

Patent OwnerAddress
LAM RESEARCH CORPORATION4650 CUSHING PARKWAY FREMONT CA 94538

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Kolics, Artur Dublin, US 74 1323
Nalla, Praveen Fremont, US 15 82
Varadarajan, Seshasayee Lake Oswego, US 53 2454

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