Highly-reliable micro-electromechanical system temperature sensor
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United States of America Patent
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May 31, 2016
Grant Date -
Jul 24, 2014
app pub date -
Jul 7, 2013
filing date -
Jan 20, 2012
priority date (Note) -
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Abstract
A sensor arrangement for wirelessly measuring temperature and vibration is disclosed. The sensor arrangement includes a sensor element and a sensor coil affixed on the device. A readout coil is configured to be magnetically coupled to the sensor coil configured to energize the sensor coil with an energizing signal, configured to provide the natural frequency of the sensor element, the sensor coil, and the readout coil, and configured to provide amplitude modulations of the energizing signal, the amplitude modulations being induced by changes in the coupling factor of the readout coil and the sensor coil. An energizing circuit is configured to energize the readout coil with the energizing signal. A readout circuit is configured to store or display information regarding the natural frequency and the amplitude modulations.
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