Via for electrical contact passing through layers of optical waveguide in multilayer structure including electrical substrate and laminated layers of optical waveguide

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United States of America Patent

PATENT NO 9354408
SERIAL NO

14646856

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Abstract

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A structure is formed which is prepared as a via for electrical contact passing through layers of an optical waveguide, in a multilayer structure including an electrical substrate and the laminated layers of the optical waveguide. The surface of an electrode pad is plated with solder. The layers of the optical waveguide are formed above the portion plated with solder are removed to expose the portion plated with solder. A device is prepared having both a light-emitter or photoreceptor in optical contact with the optical waveguide, and a stud (pillar). The stud (pillar) is inserted into the portion in which layers of the optical waveguide have been removed, and the plated solder is melted to bond the electrode pad on top of the electrical substrate to the tip of the inserted stud (pillar).

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Patent Owner(s)

  • INTERNATIONAL BUSINESS MACHINES CORPORATION

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Noma, Hirokazu Tokyo, JP 9 48
Okamoto, Keishi Tokyo, JP 40 310
Tokunari, Masao Tokyo, JP 42 202
Toriyama, Kazushige Tokyo, JP 25 173
Tsukada, Yutaka Tokyo, JP 26 607

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