Integrated circuit packaging system with interposer structure and method of manufacture thereof

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United States of America Patent

PATENT NO 9355983
SERIAL NO

14318061

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Abstract

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A system and a method of manufacture thereof of integrated circuit packaging system, including: a pillar; a conductive buildup attached to the pillar; and a molded body encapsulating the conductive buildup, the pillar extending out of the molded body.

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Patent Owner(s)

Patent OwnerAddress
STATS CHIPPAC PTE LTDSINGAPORE

International Classification(s)

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Camacho, Zigmund Ramirez Singapore, SG 173 1461
Cuong, Dao Nguyen Phu Singapore, SG 9 18
Espiritu, Emmanuel Singapore, SG 44 241
Foh, Bartholomew Liao Chung Singapore, SG 10 23
Punzalan, Jeffrey David Singapore, SG 5 10

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