Integrated circuit system with debonding adhesive and method of manufacture thereof

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United States of America Patent

PATENT NO 9355993
APP PUB NO 20150311180A1
SERIAL NO

14791287

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Importance

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Abstract

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A system and method of manufacture of an integrated circuit system includes: a die having a via, the die having a top side and a bottom side; a top interconnect mounted to the via at the top side; an interconnect pillar mounted to the via at the bottom side; a device interconnect mounted to the interconnect pillar; and a base adhesive covering the interconnect pillar and the device interconnect.

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Patent Owner(s)

Patent OwnerAddress
JCET SEMICONDUCTOR (SHAOXING) CO LTDNO 500 LINJIANG ROAD YUECHENG DISTRICT SHAOXING

International Classification(s)

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Choi, Won Kyoung Singapore, SG 68 864
Marimuthu, Pandi Chelvam Singapore, SG 45 1828

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